Understand the heat and airflow before changing the hardware.
Targeted studies for electronics teams: overheating, airflow, fan selection, venting, heatsink and thermal design trade-offs.
Or email sensio.juan@gmail.com
Typical electronics questions
- Where is the hotspot and what feeds it?
- Is air recirculating or bypassing the board?
- Does the fan operate where the curve says it should?
- Which vent, heatsink or layout change is worth prototyping?
Thermal issues aren't solved by temperature alone
Hotspots may arise from local generation, low mass flow, recirculation, vent/fan limits, or poor placement; root cause is often multifactorial. CFD separates these mechanisms and tests changes before the next prototype.
Hotspots and temperature margin: Components running hot near limits—root path unclear.
Enclosure airflow: Air bypasses critical parts/recirculates.
Fan and pressure mismatch: System resistance causes real fan point to differ from nominal.
Excessive prototype iterations: Physical trial/error without enough insight on changes.
Three focused CFD studies for electronics
Thermal & Airflow Diagnostic
Problem: A clear issue exists, but the fault mechanism is unknown.
Study activities
- •Build a baseline model
- •Map temperature and air paths
- •Spot recirculation, stagnant zones, restrictions
- •Analyze transfer paths/sensitivities
- •Identify highest-value change actions
Inputs
CAD, loads, materials, fan data (if relevant), boundary/ops conditions
Deliverables
Baseline visuals, diagnosis, ranked recommendations, technical review
Outcome
Understand what's limiting performance and what to adjust next
Timeline
Scoped after discovery around one configuration and defined conditions. No fixed turnaround is published as a guarantee.
Cooling Design Optimization
Problem: Competing design changes—team needs evidence for next prototype
Study activities
- •Define baseline/set of hypotheses
- •Compare fans, vents, heatsinks, ducts, layout, enclosures, as relevant
- •Quantify temp/airflow/pressure impacts
- •Assess trade-offs/robustness across key conditions
Deliverables
Variant comparison, engineering ranking, rationale for each, recommended next design
Timeline: Set by the number of variants and conditions agreed in discovery. No fixed turnaround is published as a guarantee.
Outcome: Choose the next cooling change from a controlled comparison.
Pressure Drop / Ventilation Performance Study
Problem: Cooling is limited by system resistance, poor distribution, or unknown fan point
Study activities
- •Quantify global/local losses
- •Identify main restrictions
- •Assess air split across paths
- •Evaluate vent/duct/fan alternatives
- •Estimate system curve/fan interaction (where data supports)
Deliverables
Pressure breakdown, airflow mapping, operating-point explanation, geometry/fan recommendations, variant comparisons
Timeline: Defined in discovery from flow-path complexity and whether a fan operating-point review is included.
Outcome: See where losses occur and which geometry or hardware change to try next.
Example study logic
- 1 Prototype overheats
- 2 Team increases fan/vents
- 3 New prototype built
- 4 Result: temperature changes, but issue unresolved
- 1 CFD identifies recirculation + inlet restriction
- 2 Two geometry changes compared
- 3 Best option = better flow, lower resistance
- 4 Next prototype is a justified change, not guesswork
This is a demonstration of the approach, not a real client case.
Value in CFD is not just contours—it's robust modelling
A thermal model is only as useful as its underlying assumptions. Define geometry simplifications, heat loads, materials, fan representations, boundary/turbulence models, and checks at a level which matches the engineering decision.
- ✓All assumptions captured
- ✓Mesh/sensitivity checked when it matters
- ✓Boundary condition uncertainty discussed
- ✓Measurements or known data compared if available
- ✓Limitations stated in reporting
From product data to engineering decision
01
CAD + operating conditions
02
Model setup
03
Baseline simulation
04
Engineering diagnosis
05
Design variants
06
Comparison
07
Decision / recommendations
The deliverable is a cooling or airflow decision, not a set of unused contour plots.
Inputs
What I need from you
Exact inputs are defined during discovery.
- CAD or geometry at suitable fidelity
- Materials / thermal properties when relevant
- Heat loads and operating points
- Fan curves or ventilation information when relevant
- Boundary and ambient conditions
- Prototype or test observations if available
Deliverables
What you receive
Formal certification is not implied unless separately agreed.
- Assumptions and model definition
- Key temperature, flow and pressure visualizations
- Diagnosis of dominant issues
- Comparison table for agreed variants
- Prioritized engineering recommendations
- Technical review call
- Concise report or the package agreed in discovery
Electronics FAQ
Assumptions, geometry simplifications, heat loads and fan representations are written down. Mesh or sensitivity checks are used when they can change the conclusion. Measurements are compared when the team has them. Limits are stated in the report.
Bring the thermal problem, not a predefined CFD scope
If you can describe what is overheating, what has already been tried, and the next hardware decision, we can see whether a focused CFD study is appropriate.
sensio.juan@gmail.com — no public booking calendar.